AM100474-10DC
vs
SY100474-7DCS
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SYNERGY SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP24,.4
|
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
10 ns
|
7 ns
|
I/O Type |
SEPARATE
|
SEPARATE
|
JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Length |
30.5435 mm
|
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
1KX4
|
1KX4
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Enable |
NO
|
NO
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.4
|
DIP24,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.588 mm
|
|
Supply Current-Max |
0.23 mA
|
0.22 mA
|
Surface Mount |
NO
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
|
Base Number Matches |
1
|
3
|
Additional Feature |
|
TEMP SPECIFIED AS TC
|
|
|
|
Compare AM100474-10DC with alternatives