AK41128HNI-12
vs
AK41128HNI-12LP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Contact Manufacturer
Ihs Manufacturer
ACCUTEK MICROCIRCUIT CORP
ACCUTEK MICROCIRCUIT CORP
Part Package Code
DIP
DIP
Package Description
HERMETIC SEALED, CERAMIC, DIP-18
HERMETIC SEALED, CERAMIC, DIP-18
Pin Count
18
18
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
NIBBLE
NIBBLE
Access Time-Max
120 ns
120 ns
Additional Feature
RAS ONLY/HIDDEN REFRESH
RAS ONLY/HIDDEN REFRESH
JESD-30 Code
R-GDIP-T18
R-GDIP-T18
Memory Density
131072 bit
131072 bit
Memory IC Type
DRAM MODULE
DRAM MODULE
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-45 °C
-45 °C
Organization
128KX1
128KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
128
256
Supply Current-Max
0.054 mA
0.054 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
NMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare AK41128HNI-12 with alternatives
Compare AK41128HNI-12LP with alternatives