AHA4524A-031PTIG
vs
DS33X42+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
COMTECH AHA CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFP
|
BGA
|
Package Description |
TFQFP,
|
BGA,
|
Pin Count |
64
|
256
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G64
|
S-PBGA-B256
|
Length |
7 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.2 mm
|
1.77 mm
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.4 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
7 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
JESD-609 Code |
|
e1
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AHA4524A-031PTIG with alternatives
Compare DS33X42+ with alternatives