AGLP125V5-CSG281I
vs
AGLP125V5-CSG281
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
TFBGA, BGA281,19X19,20
|
10 X 10 MM, 1.05 MM HEIGHT, 0.5 MM PITCH, ROHS COMPLIANT, CSP-281
|
Pin Count |
281
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
250 MHz
|
250 MHz
|
JESD-30 Code |
S-PBGA-B281
|
S-PBGA-B281
|
Length |
10 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
3120
|
3120
|
Number of Equivalent Gates |
125000
|
125000
|
Number of Inputs |
212
|
212
|
Number of Logic Cells |
3120
|
3120
|
Number of Outputs |
212
|
212
|
Number of Terminals |
281
|
281
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
3120 CLBS, 125000 GATES
|
3120 CLBS, 125000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA281,19X19,20
|
BGA281,19X19,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.05 mm
|
1.05 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
4
|
|
|
|
Compare AGLP125V5-CSG281I with alternatives
Compare AGLP125V5-CSG281 with alternatives