AGLN060V2-VQ100I vs AGLN060V2-ZVQG100 feature comparison

AGLN060V2-VQ100I Microsemi Corporation

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AGLN060V2-ZVQG100 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description TFQFP, 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e0 e3
Length 14 mm 14 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Terminals 100 100
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -20 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP TFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 2
Factory Lead Time 8 Weeks
Clock Frequency-Max 160 MHz
Number of Inputs 71
Number of Outputs 71

Compare AGLN060V2-VQ100I with alternatives

Compare AGLN060V2-ZVQG100 with alternatives