AGL250V5-CS196I
vs
M1AGL250V5-CS196
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ACTEL CORP
MICROSEMI CORP
Package Description
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, CSP-196
TFBGA, BGA196,14X14,20
Reach Compliance Code
compliant
unknown
Clock Frequency-Max
108 MHz
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
8 mm
8 mm
Number of CLBs
6144
6144
Number of Equivalent Gates
250000
250000
Number of Inputs
143
143
Number of Logic Cells
6144
6144
Number of Outputs
143
143
Number of Terminals
196
196
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 250000 GATES
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA196,14X14,20
BGA196,14X14,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
8 mm
Base Number Matches
3
3
HTS Code
8542.39.00.01
JESD-609 Code
e0
Terminal Finish
TIN LEAD SILVER
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