AGL250V2-CS196I
vs
M1AGL250V2-CSG196I
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
TFBGA,
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-196
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
108 MHz
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
8 mm
8 mm
Number of CLBs
6144
6144
Number of Equivalent Gates
250000
250000
Number of Terminals
196
196
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
6144 CLBS, 250000 GATES
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA196,14X14,20
BGA196,14X14,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
8 mm
8 mm
Base Number Matches
3
3
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of Inputs
143
Number of Logic Cells
6144
Number of Outputs
143
Terminal Finish
TIN SILVER COPPER
Compare AGL250V2-CS196I with alternatives
Compare M1AGL250V2-CSG196I with alternatives