AGL1000V2-CSG281Y
vs
AGL1000V2-CSG281Y
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
CSP-281
|
|
| Pin Count |
281
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
TERM PITCH-MIN
|
|
| Clock Frequency-Max |
250 MHz
|
108 MHz
|
| JESD-30 Code |
S-PBGA-B281
|
S-PBGA-B281
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
1000000
|
1000000
|
| Number of Terminals |
281
|
281
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1000000 GATES
|
24576 CLBS, 1000000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA281,19X19,20
|
BGA281,19X19,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.05 mm
|
1.05 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.5 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
6
|
4
|
| Number of Inputs |
|
215
|
| Number of Logic Cells |
|
24576
|
| Number of Outputs |
|
215
|
|
|
|
Compare AGL1000V2-CSG281Y with alternatives
Compare AGL1000V2-CSG281Y with alternatives