AFS600-2FGG256I vs M1AFS600-FGG256 feature comparison

AFS600-2FGG256I Actel Corporation

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M1AFS600-FGG256 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer ACTEL CORP MICROCHIP TECHNOLOGY INC
Package Description 1 MM PITCH, GREEN, FBGA-256 FBGA-256
Reach Compliance Code compliant compliant
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Inputs 119
Number of Logic Cells 13824
Number of Outputs 119
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.68 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 3 3
HTS Code 8542.39.00.01
Factory Lead Time 16 Weeks
Packing Method TRAY
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

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