AFS600-1FGG256
vs
U1AFS600-FGG256
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
14 Weeks
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
Number of Equivalent Gates
600000
600000
Number of Inputs
119
159
Number of Outputs
119
159
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
13824 CLBS, 600000 GATES
600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.68 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
22
4
ECCN Code
3A991.D
Number of Logic Cells
13824
Compare AFS600-1FGG256 with alternatives
Compare U1AFS600-FGG256 with alternatives