ADXRS613BBGZ
vs
ADXRS613WBBGZA-RL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ANALOG DEVICES INC
ANALOG DEVICES INC
Part Package Code
BGA
BGA
Package Description
FBGA,
FBGA,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Analog Devices
Analog IC - Other Type
ANALOG CIRCUIT
ANALOG CIRCUIT
JESD-30 Code
S-CBGA-B32
S-CBGA-B32
Length
6.85 mm
6.85 mm
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
FBGA
FBGA
Package Equivalence Code
BGA32,7X7,32
BGA32,7X7,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.8 mm
3.8 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIMOS
BIMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
6.85 mm
6.85 mm
Base Number Matches
1
1
Compare ADXRS613BBGZ with alternatives
Compare ADXRS613WBBGZA-RL with alternatives