ADSPBF504BCPZ-ENG
vs
ADSP-BF504BCPZ-4
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
12 X 12 MM, ROHS COMPLIANT, MO-220VRRD, LFCSP-88
|
HVQCCN,
|
Pin Count |
88
|
88
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Additional Feature |
ALSO OPERATES AT 2.5 AND 3.3 V TYP
|
|
Address Bus Width |
3
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-XQCC-N88
|
S-XQCC-N88
|
Length |
12 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
88
|
88
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
0.85 mm
|
0.85 mm
|
Supply Voltage-Max |
3.6 V
|
5.25 V
|
Supply Voltage-Min |
1.7 V
|
2.7 V
|
Supply Voltage-Nom |
1.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
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