ADSP-BF533SBBCZ500
vs
ADSP-BF533SBBCZ-5V
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ANALOG DEVICES INC
ROCHESTER ELECTRONICS INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA160,14X14,32
LFBGA,
Pin Count
160
160
Manufacturer Package Code
BC-160-2
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Samacsys Manufacturer
Analog Devices
Additional Feature
ALSO REQUIRES 3V OR 3.3V SUPPLY
ALSO REQUIRES 3V OR 3.3V SUPPLY
Address Bus Width
19
19
Barrel Shifter
YES
YES
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B160
S-PBGA-B160
JESD-609 Code
e1
e1
Length
12 mm
12 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
160
160
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA160,14X14,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.7 mm
1.7 mm
Speed
500 MHz
Supply Voltage-Max
1.45 V
1.45 V
Supply Voltage-Min
0.8 V
0.8 V
Supply Voltage-Nom
1.2 V
1.25 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
12 mm
12 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
2
2
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