ADSP-21062LKB-160
vs
ADSP-21062LAB-160
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
ANALOG DEVICES INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA225,15X15,50
Pin Count
225
225
Reach Compliance Code
unknown
unknown
Address Bus Width
32
32
Barrel Shifter
YES
YES
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
48
48
Format
FLOATING POINT
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B225
S-PBGA-B225
JESD-609 Code
e0
e0
Length
23 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
225
225
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.7 mm
2.7 mm
Supply Voltage-Max
3.45 V
3.45 V
Supply Voltage-Min
3.15 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD SILVER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
2
1
Manufacturer Package Code
B-225-2
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Bit Size
32
Package Equivalence Code
BGA225,15X15,50
RAM (words)
65536
Supply Current-Max
600 mA
Compare ADSP-21062LKB-160 with alternatives
Compare ADSP-21062LAB-160 with alternatives