ADSP-21060KS-133
vs
ADSP-21020KG-80
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QFP
PGA
Package Description
HFQFP,
CERAMIC, PGA-223
Pin Count
240
223
Reach Compliance Code
unknown
unknown
Additional Feature
16/32 BIT PARALLEL HOST INTFC PORT; SINGLE CY INSTR EXECUTION; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED
SINGLE CYCLE INSTR EXECUTION; 100 MFLOPS PEAK; 66 MFLOPS SUSTAINED; ADDRESSING OF PAGE MODE DRAM
Address Bus Width
32
24
Barrel Shifter
YES
YES
Boundary Scan
YES
YES
Clock Frequency-Max
33.33 MHz
20 MHz
External Data Bus Width
48
48
Format
FLOATING POINT
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQFP-G240
S-CPGA-P223
JESD-609 Code
e0
e0
Length
32 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
240
223
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
HFQFP
PGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, HEAT SINK/SLUG, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
COMMERCIAL
COMMERCIAL
Seated Height-Max
4.1 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
0.5 mm
Terminal Position
QUAD
PERPENDICULAR
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
32 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
2
2
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