ADSP-1401KP
vs
CY7C9116-65LMB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
QCCJ,
|
CERAMIC, LCC-52
|
| Pin Count |
52
|
52
|
| Reach Compliance Code |
unknown
|
compliant
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQCC-J52
|
S-CQCC-N52
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.1262 mm
|
19.05 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Terminals |
52
|
52
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
QCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.54 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
19.1262 mm
|
19.05 mm
|
| uPs/uCs/Peripheral ICs Type |
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
|
BIT-SLICE MICROPROCESSOR
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.31.00.01
|
| Bit Size |
|
16
|
| Clock Frequency-Max |
|
15.4 MHz
|
| Package Equivalence Code |
|
LCC52,.75SQ
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Speed |
|
28.6 MHz
|
| Supply Current-Max |
|
166 mA
|
|
|
|
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