ADS1196CPAG
vs
ADS1196CZXGR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
GREEN, PLASTIC, TQFP-64
|
LFBGA,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
ALSO OPERATES WITH 1.65V TO 3.6V DIGITAL SUPPLY
|
ALSO OPERATES WITH 1.65V TO 3.6V DIGITAL SUPPLY
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
S-PQFP-G64
|
S-PBGA-B64
|
| JESD-609 Code |
e4
|
e1
|
| Length |
10 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.45 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ADS1196CPAG with alternatives
Compare ADS1196CZXGR with alternatives