ADP172ACBZ-1.5-R7
vs
ADP172ACBZ-1.8-R7
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
BGA
|
BGA
|
| Pin Count |
4
|
4
|
| Manufacturer Package Code |
CB-4-4
|
CB-4-4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.05 V
|
0.1 V
|
| Dropout Voltage1-Nom |
0.5 V
|
0.05 V
|
| Input Voltage Absolute-Max |
4 V
|
4 V
|
| Input Voltage-Max |
3.6 V
|
3.6 V
|
| Input Voltage-Min |
1.6 V
|
1.6 V
|
| JESD-30 Code |
R-PBGA-B4
|
R-PBGA-B4
|
| JESD-609 Code |
e1
|
e1
|
| Length |
1.025 mm
|
1.025 mm
|
| Line Regulation-Max |
0.006%
|
|
| Load Regulation-Max |
0.0224%
|
0.027%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
1.5225 V
|
1.827 V
|
| Output Voltage1-Min |
1.455 V
|
1.746 V
|
| Output Voltage1-Nom |
1.5 V
|
1.8 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA4,2X2,20
|
BGA4,2X2,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.64 mm
|
0.64 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Voltage Tolerance-Max |
3%
|
3%
|
| Width |
0.95 mm
|
0.95 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ADP172ACBZ-1.5-R7 with alternatives
Compare ADP172ACBZ-1.8-R7 with alternatives