ADP1706ACPZ-1.5-R7
vs
S-13A1A15-E6T1U3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ABLIC INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
HVQCCN,
|
HSOP-6
|
| Pin Count |
8
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.5 V
|
1.5 V
|
| JESD-30 Code |
S-XQCC-N8
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
5.02 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
6
|
| Operating Temperature TJ-Max |
125 °C
|
|
| Operating Temperature TJ-Min |
-40 °C
|
|
| Output Current1-Max |
1 A
|
0.3 A
|
| Output Voltage1-Max |
1.5375 V
|
1.515 V
|
| Output Voltage1-Min |
1.4625 V
|
1.485 V
|
| Output Voltage1-Nom |
1.5 V
|
1.5 V
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.9 mm
|
1.75 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.91 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Dropout Voltage1-Max |
|
0.15 V
|
| Dropout Voltage1-Nom |
|
0.1 V
|
| Load Regulation-Max |
|
0.02%
|
| Voltage Tolerance-Max |
|
1%
|
|
|
|
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