ADL5502ACBZ-P7
vs
ZL70102UEJ2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MICROSEMI CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
WLCSP-8
|
VFBGA, BGA49,7X10,16
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
CB-8-3
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| JESD-30 Code |
S-PBGA-B8
|
R-PBGA-B49
|
| JESD-609 Code |
e1
|
|
| Length |
1.46 mm
|
4.215 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
49
|
| Operating Temperature-Max |
85 °C
|
55 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.625 mm
|
0.425 mm
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.46 mm
|
3.085 mm
|
| Base Number Matches |
1
|
3
|
| Package Equivalence Code |
|
BGA49,7X10,16
|
|
|
|
Compare ADL5502ACBZ-P7 with alternatives
Compare ZL70102UEJ2 with alternatives