ADL5502ACBZ-P2
vs
MAX2365ETM+
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
QFN
|
| Package Description |
VFBGA,
|
7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
|
| Pin Count |
8
|
48
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A991.B
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B8
|
S-XQCC-N48
|
| JESD-609 Code |
e1
|
e3
|
| Length |
1.46 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
0.625 mm
|
0.8 mm
|
| Supply Voltage-Nom |
3 V
|
2.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
1.46 mm
|
7 mm
|
| Base Number Matches |
1
|
2
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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