ADG820BRM-R2 vs ADG784BCP-REEL7 feature comparison

ADG820BRM-R2 Analog Devices Inc

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ADG784BCP-REEL7 Analog Devices Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code SOIC QFN
Package Description MICRO, SOIC-8 CSP-20
Pin Count 8 20
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SINGLE-ENDED MULTIPLEXER
JESD-30 Code S-PDSO-G8 S-XQCC-N20
JESD-609 Code e0 e0
Length 3 mm 4 mm
Moisture Sensitivity Level 1 3
Number of Channels 1 2
Number of Functions 1 4
Number of Terminals 8 20
Off-state Isolation-Nom 71 dB 65 dB
On-state Resistance Match-Nom 0.06 Ω 0.15 Ω
On-state Resistance-Max (Ron) 1.4 Ω 10 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP8,.19 LCC20,.16SQ,20
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.09 mm 0.9 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 1.8 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 45 ns 10 ns
Switch-on Time-Max 35 ns 25 ns
Switching MAKE-BEFORE-BREAK BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Width 3 mm 4 mm
Base Number Matches 1 2
Additional Feature ALSO OPERATES AT 5V SUPPLY
Signal Current-Max 0.1 A
Supply Current-Max (Isup) 0.001 mA

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