ADG819BCB vs ADG820BRM feature comparison

ADG819BCB Analog Devices Inc

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ADG820BRM Analog Devices Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code BGA SOIC
Package Description VFBGA, BGA6,2X3,20 TSSOP, TSSOP8,.19
Pin Count 6 8
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-XBGA-B6 S-PDSO-G8
JESD-609 Code e0 e0
Length 2.18 mm 3 mm
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 8
Off-state Isolation-Nom 71 dB 71 dB
On-state Resistance Match-Nom 0.06 Ω 0.06 Ω
On-state Resistance-Max (Ron) 1.4 Ω 1.4 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA6,2X3,20 TSSOP8,.19
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.67 mm 1.09 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 16 ns 45 ns
Switch-on Time-Max 60 ns 35 ns
Switching BREAK-BEFORE-MAKE MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Width 1.14 mm 3 mm
Base Number Matches 6 5
Samacsys Manufacturer Analog Devices
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 240

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