ADG819BCB
vs
ADG819BRT-R2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
BGA
|
SOT-23
|
| Package Description |
VFBGA, BGA6,2X3,20
|
LSSOP, TSOP6,.11,37
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-XBGA-B6
|
R-PDSO-G6
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2.18 mm
|
2.9 mm
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Off-state Isolation-Nom |
71 dB
|
71 dB
|
| On-state Resistance Match-Nom |
0.06 Ω
|
0.06 Ω
|
| On-state Resistance-Max (Ron) |
1.4 Ω
|
1.4 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
LSSOP
|
| Package Equivalence Code |
BGA6,2X3,20
|
TSOP6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.67 mm
|
1.45 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
16 ns
|
16 ns
|
| Switch-on Time-Max |
60 ns
|
60 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
1.14 mm
|
1.65 mm
|
| Base Number Matches |
6
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare ADG819BCB with alternatives
Compare ADG819BRT-R2 with alternatives