ADG802BCB-REEL7
vs
MAX326MJE
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
BGA
|
DIP
|
| Package Description |
VFBGA,
|
DIP,
|
| Pin Count |
6
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PBGA-B6
|
R-GDIP-T16
|
| Length |
2.18 mm
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
6
|
16
|
| Off-state Isolation-Nom |
61 dB
|
70 dB
|
| On-state Resistance-Max (Ron) |
0.6 Ω
|
2500 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
VFBGA
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
IN-LINE
|
| Seated Height-Max |
0.67 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
15 ns
|
500 ns
|
| Switch-on Time-Max |
55 ns
|
1000 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Form |
BALL
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
1.14 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage-Max (Vsup) |
|
-18 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-5 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| On-state Resistance Match-Nom |
|
125 Ω
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare ADG802BCB-REEL7 with alternatives
Compare MAX326MJE with alternatives