ADG784BCP-REEL vs ADG819BCB-REEL feature comparison

ADG784BCP-REEL Rochester Electronics LLC

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ADG819BCB-REEL Analog Devices Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC ANALOG DEVICES INC
Part Package Code QFN BGA
Package Description HVQCCN, VFBGA, BGA6,2X3,20
Pin Count 20 6
Reach Compliance Code unknown unknown
Additional Feature ALSO OPERATES AT 5V SUPPLY
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER SPDT
JESD-30 Code S-XQCC-N20 R-XBGA-B6
JESD-609 Code e0 e0
Length 4 mm 2.18 mm
Moisture Sensitivity Level 3 1
Number of Channels 2 1
Number of Functions 4 1
Number of Terminals 20 6
Off-state Isolation-Nom 65 dB 71 dB
On-state Resistance Match-Nom 0.15 Ω 0.06 Ω
On-state Resistance-Max (Ron) 10 Ω 1.4 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code HVQCCN VFBGA
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 0.9 mm 0.67 mm
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 10 ns 16 ns
Switch-on Time-Max 25 ns 60 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm 1.14 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
Package Equivalence Code BGA6,2X3,20
Switching BREAK-BEFORE-MAKE

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