ADG751ARMZ-REEL
vs
ADG819BCB-REEL
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
TSSOP,
|
VFBGA,
|
| Pin Count |
8
|
6
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
CAN ALSO BE OPERATED FROM 4.5 TO 5.5V
|
|
| Analog IC - Other Type |
SPST
|
SPDT
|
| JESD-30 Code |
S-PDSO-G8
|
R-XBGA-B6
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
2.18 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
6
|
| Off-state Isolation-Nom |
65 dB
|
71 dB
|
| On-state Resistance-Max (Ron) |
50 Ω
|
1.4 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
1.09 mm
|
0.67 mm
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
6 ns
|
16 ns
|
| Switch-on Time-Max |
19 ns
|
60 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
1.14 mm
|
| Base Number Matches |
2
|
2
|
| On-state Resistance Match-Nom |
|
0.06 Ω
|
|
|
|
Compare ADG751ARMZ-REEL with alternatives
Compare ADG819BCB-REEL with alternatives