ADG702LBRM-REEL7
vs
ADG702LBRMZ-REEL7
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ANALOG DEVICES INC
ANALOG DEVICES INC
Part Package Code
TSSOP
TSSOP
Package Description
MO-187AA, MSOP-8
LEAD FREE, MO-187AA, MSOP-8
Pin Count
8
8
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Analog Devices
Analog IC - Other Type
SPST
SPST
JESD-30 Code
S-PDSO-G8
S-PDSO-G8
JESD-609 Code
e0
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
1
1
Normal Position
NO
NO
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Off-state Isolation-Nom
55 dB
55 dB
On-state Resistance Match-Nom
1.5 Ω
1.5 Ω
On-state Resistance-Max (Ron)
5 Ω
5 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP8,.19
TSSOP8,.19
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Switch-off Time-Max
13 ns
13 ns
Switch-on Time-Max
20 ns
20 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3 mm
Base Number Matches
1
1
Manufacturer Package Code
RM-8
Compare ADG702LBRM-REEL7 with alternatives
Compare ADG702LBRMZ-REEL7 with alternatives