ADG609BRU-REEL7
vs
HI1-0509-9
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ANALOG DEVICES INC
HARRIS SEMICONDUCTOR
Part Package Code
TSSOP
Package Description
TSSOP, TSSOP16,.25
DIP-16
Pin Count
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
OPERATION WITH SINGLE 3V/5V ALSO POSSIBLE
Analog IC - Other Type
DIFFERENTIAL MULTIPLEXER
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
5 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-5.5 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-15 V
Number of Channels
4
4
Number of Functions
1
1
Number of Terminals
16
16
Off-state Isolation-Nom
85 dB
On-state Resistance Match-Nom
2 Ω
On-state Resistance-Max (Ron)
30 Ω
400 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Signal Current-Max
0.02 A
0.02 A
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
YES
NO
Switch-off Time-Max
75 ns
Switch-on Time-Max
75 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
Base Number Matches
2
3
Compare ADG609BRU-REEL7 with alternatives
Compare HI1-0509-9 with alternatives