ADG509ATQ
vs
ADG509ABQ
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-16
|
CERAMIC, DIP-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
Q-16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Additional Feature |
ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY
|
ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.495 mm
|
19.495 mm
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
-16.5 V
|
| Neg Supply Voltage-Min (Vsup) |
-10.8 V
|
-10.8 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
68 dB
|
68 dB
|
| On-state Resistance Match-Nom |
22.5 Ω
|
22.5 Ω
|
| On-state Resistance-Max (Ron) |
450 Ω
|
450 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Signal Current-Max |
0.02 A
|
|
| Supply Current-Max (Isup) |
1.5 mA
|
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
16.5 V
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
10.8 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
300 ns
|
300 ns
|
| Switch-on Time-Max |
300 ns
|
300 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
|
|
|
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