ADG509AKP
vs
HI4P0201-5Z
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LPCC
|
|
| Package Description |
QCCJ,
|
QCCN,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY
|
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
SPST
|
| JESD-30 Code |
S-PQCC-J20
|
R-PQCC-N20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8.965 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-10.8 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
4
|
1
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
20
|
20
|
| Off-state Isolation-Nom |
68 dB
|
80 dB
|
| On-state Resistance Match-Nom |
22.5 Ω
|
|
| On-state Resistance-Max (Ron) |
450 Ω
|
80 Ω
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCN
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
300 ns
|
|
| Switch-on Time-Max |
300 ns
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
8.965 mm
|
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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