ADG3247BCP-REEL
vs
ADG3247BRU-REEL7
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
VQCCN,
|
TSSOP-38
|
| Pin Count |
40
|
38
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Family |
ADG3247
|
|
| JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G38
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6 mm
|
9.7 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
40
|
38
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
240
|
| Propagation Delay (tpd) |
0.225 ns
|
0.225 ns
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
TSSOP38,.25,20
|
| Packing Method |
|
TR, 7 INCH
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare ADG3247BCP-REEL with alternatives
Compare ADG3247BRU-REEL7 with alternatives