ADG221TQ
vs
ADG221TQ/883B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.495 mm
|
19.05 mm
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Normal Position |
NC
|
NC
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
80 dB
|
60 dB
|
| On-state Resistance Match-Nom |
5 Ω
|
3 Ω
|
| On-state Resistance-Max (Ron) |
90 Ω
|
90 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
5.08 mm
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
250 ns
|
500 ns
|
| Switch-on Time-Max |
300 ns
|
600 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Supply Current-Max (Isup) |
|
2 mA
|
|
|
|
Compare ADG221TQ with alternatives
Compare ADG221TQ/883B with alternatives