ADG201AKPZ
vs
HI4-0508-8
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
INTERSIL CORP
|
Part Package Code |
QLCC
|
|
Package Description |
PLASTIC, LCC-20
|
|
Pin Count |
20
|
|
Manufacturer Package Code |
P-20
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Analog Devices
|
|
Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
S-PQCC-J20
|
S-XQCC-N20
|
JESD-609 Code |
e3
|
e0
|
Length |
8.966 mm
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
1
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Off-state Isolation-Nom |
80 dB
|
|
On-state Resistance Match-Nom |
5 Ω
|
|
On-state Resistance-Max (Ron) |
90 Ω
|
400 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
QCCJ
|
QCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
250 ns
|
|
Switch-on Time-Max |
300 ns
|
500 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
8.966 mm
|
|
Base Number Matches |
2
|
2
|
Package Equivalence Code |
|
LCC20,.35SQ
|
Screening Level |
|
MIL-STD-883 Class B (Modified)
|
Signal Current-Max |
|
0.02 A
|
Supply Current-Max (Isup) |
|
2.4 mA
|
Switching |
|
BREAK-BEFORE-MAKE
|
|
|
|
Compare ADG201AKPZ with alternatives