ADG1413YCPZ-REEL7
vs
MUX24BQ
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
QFN
|
DIP
|
Package Description |
HVQCCN,
|
DIP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY
|
OVERVOLTAGE PROTECTION
|
Analog IC - Other Type |
SPST
|
DIFFERENTIAL MULTIPLEXER
|
JESD-30 Code |
S-XQCC-N16
|
R-GDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
19.05 mm
|
Moisture Sensitivity Level |
3
|
NOT SPECIFIED
|
Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
|
Neg Supply Voltage-Min (Vsup) |
-4.5 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
Number of Channels |
1
|
4
|
Number of Functions |
4
|
1
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
80 dB
|
66 dB
|
On-state Resistance Match-Nom |
0.13 Ω
|
27 Ω
|
On-state Resistance-Max (Ron) |
5.4 Ω
|
400 Ω
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
Package Code |
HVQCCN
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Seated Height-Max |
1 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
16.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Switch-off Time-Max |
380 ns
|
600 ns
|
Switch-on Time-Max |
510 ns
|
2000 ns
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
Width |
4 mm
|
7.62 mm
|
Base Number Matches |
2
|
3
|
|
|
|
Compare ADG1413YCPZ-REEL7 with alternatives
Compare MUX24BQ with alternatives