ADF4153YCPZ-RL
vs
ADF4153BCPZ
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-1, LFCSP-20
|
HVQCCN,
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
CP-20-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
PLL FREQUENCY SYNTHESIZER
|
PLL FREQUENCY SYNTHESIZER
|
| JESD-30 Code |
S-XQCC-N20
|
S-XQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max (Isup) |
24 mA
|
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
1
|
2
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare ADF4153YCPZ-RL with alternatives
Compare ADF4153BCPZ with alternatives