ADF0805210K1%100PPM/KKP
vs
MC0805P-2103-FB101
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROTECH GMBH ELECTRONIC
|
RCD COMPONENTS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
2 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.25 mm
|
1.25 mm
|
| Packing Method |
Cardboard
|
BULK
|
| Rated Power Dissipation (P) |
0.125 W
|
0.125 W
|
| Reference Standard |
AEC-Q200
|
|
| Resistance |
210000 Ω
|
210000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0805
|
0805
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
TIN OVER NICKEL
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Additional Feature |
|
PRECISION
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare ADF0805210K1%100PPM/KKP with alternatives
Compare MC0805P-2103-FB101 with alternatives