ADF08051K1%100PPM/KKP
vs
RC2012F1001GS
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROTECH GMBH ELECTRONIC
|
SAMSUNG SEMICONDUCTOR INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
2 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.25 mm
|
1.25 mm
|
| Packing Method |
Cardboard
|
Bulk
|
| Rated Power Dissipation (P) |
0.125 W
|
0.125 W
|
| Reference Standard |
AEC-Q200
|
|
| Resistance |
1000 Ω
|
1000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0805
|
0805
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
-100,100 ppm/°C
|
| Terminal Finish |
TIN OVER NICKEL
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
SMT, 0805
|
| Manufacturer Series |
|
RC(PRECISION)
|
| Series |
|
RC(PRECISION)
|
|
|
|
Compare ADF08051K1%100PPM/KKP with alternatives
Compare RC2012F1001GS with alternatives