ADC16061CCVT/NOPB
vs
ADC16061CCVT
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, QFP52,.47SQ
|
TQFP-52
|
| Pin Count |
52
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
2.2 V
|
2.2 V
|
| Analog Input Voltage-Min |
1.8 V
|
1.8 V
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
S-PQFP-G52
|
S-PQFP-G52
|
| JESD-609 Code |
e3
|
e0
|
| Length |
10 mm
|
10 mm
|
| Linearity Error-Max (EL) |
0.0137%
|
0.0137%
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
52
|
52
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
2'S COMPLEMENT BINARY
|
2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Equivalence Code |
QFP52,.47SQ
|
QFP52,.47SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
2.5 MHz
|
2.5 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
|
|
|