ADC1213D065HN/C1
vs
ADC1213D065HN/C1
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2 V
|
2 V
|
| Analog Input Voltage-Min |
1 V
|
1 V
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
S-PQCC-N56
|
S-PQCC-N56
|
| Length |
8 mm
|
8 mm
|
| Linearity Error-Max (EL) |
0.1221%
|
0.1221%
|
| Number of Analog In Channels |
2
|
2
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE
|
OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE
|
| Output Format |
SERIAL
|
SERIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
65 MHz
|
65 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN
|
|
|
|
Compare ADC1213D065HN/C1 with alternatives