ADC1207S080HW
vs
ADC1207S080HW/C1,1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| parentfamilyid |
1075034
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HTFQFP, TQFP48,.35SQ
|
HTFQFP, TQFP48,.35SQ
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
3.65 V
|
3.65 V
|
| Analog Input Voltage-Min |
2.75 V
|
2.75 V
|
| Converter Type |
ADC, RESISTANCE LADDER
|
ADC, RESISTANCE LADDER
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
| Length |
7 mm
|
7 mm
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HTFQFP
|
| Package Equivalence Code |
TQFP48,.35SQ
|
TQFP48,.35SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
80 MHz
|
80 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
6
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Terminal Finish |
|
TIN
|
|
|
|