ADC1010S065HN/C1
vs
ADC1010S105HN/C1
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN,
|
HVQCCN,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
2 V
|
2 V
|
Analog Input Voltage-Min |
1 V
|
1 V
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N40
|
Length |
6 mm
|
6 mm
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE
|
OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE
|
Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
65 MHz
|
105 MHz
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare ADC1010S065HN/C1 with alternatives
Compare ADC1010S105HN/C1 with alternatives