ADC10065CIMT
vs
ADC12191CIVT/NOPB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
TSSOP, TSSOP28,.25
|
LQFP, QFP32,.35SQ,32
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
1.5 V
|
2 V
|
Analog Input Voltage-Min |
0.5 V
|
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
R-PDSO-G28
|
S-PQFP-G32
|
JESD-609 Code |
e0
|
e3
|
Length |
9.7 mm
|
7 mm
|
Linearity Error-Max (EL) |
0.1074%
|
0.0562%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
10
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
LQFP
|
Package Equivalence Code |
TSSOP28,.25
|
QFP32,.35SQ,32
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
FLATPACK, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
235
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
65 MHz
|
10 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
1.1 mm
|
1.6 mm
|
Supply Voltage-Nom |
3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
4.4 mm
|
7 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare ADC10065CIMT with alternatives
Compare ADC12191CIVT/NOPB with alternatives