ADC1003S030TS/C1,1
vs
ADC1003S030TS/C1:1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP,
|
SSOP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| Analog Input Voltage-Max |
2 V
|
2 V
|
| Analog Input Voltage-Min |
1.9 V
|
1.9 V
|
| Converter Type |
ADC, RESISTANCE LADDER
|
ADC, RESISTANCE LADDER
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| JESD-609 Code |
e4
|
e4
|
| Length |
10.2 mm
|
10.2 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.1953%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
30 MHz
|
30 MHz
|
| Seated Height-Max |
2 mm
|
2 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
5.3 mm
|
5.3 mm
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
|
|
|