ADC09SJ800AAVTQ1
vs
ADC09SJ800AAVT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
FCBGA-144
|
FCBGA-144
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
Peak-to-peak input voltage range(V) : 0.8
|
Peak-to-peak input voltage range(V) : 0.8
|
Analog Input Voltage-Max |
0.8 V
|
0.8 V
|
Analog Input Voltage-Min |
-0.8 V
|
-0.8 V
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e1
|
e1
|
Length |
10 mm
|
10 mm
|
Linearity Error-Max (EL) |
0.09765%
|
0.09765%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
9
|
9
|
Number of Functions |
1
|
1
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
2S COMPLEMENT, OFFSET BINARY
|
Output Format |
SERIAL
|
SERIAL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA144,12X12,32
|
BGA144,12X12,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Sample Rate |
800 MHz
|
800 MHz
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.94 mm
|
1.94 mm
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ADC09SJ800AAVTQ1 with alternatives
Compare ADC09SJ800AAVT with alternatives