ADC08831IMMX
vs
ADC08831IMM/NOPB
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
MSOP
|
MSOP
|
Package Description |
TSSOP, TSSOP8,.19
|
TSSOP, TSSOP8,.19
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
5.05 V
|
5.05 V
|
Analog Input Voltage-Min |
-0.05 V
|
-0.05 V
|
Conversion Time-Max |
4 µs
|
4 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
SERIAL
|
SERIAL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
0.181 MHz
|
0.181 MHz
|
Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare ADC08831IMMX with alternatives
Compare ADC08831IMM/NOPB with alternatives