ADC0808CCN vs ML2258BMJ feature comparison

ADC0808CCN National Semiconductor Corporation

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ML2258BMJ RF Micro Devices Inc

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MICRO LINEAR CORP
Package Description PLASTIC, DIP-28 DIP, DIP28,.6
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 6.1 V 6.8 V
Analog Input Voltage-Min -0.1 V -0.3 V
Conversion Time-Max 116 µs 670 µs
Converter Type ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 Code R-PDIP-T28 R-GDIP-T20
JESD-609 Code e0 e0
Length 36.83 mm 24.51 mm
Linearity Error-Max (EL) 1.1719% 0.195%
Moisture Sensitivity Level 1
Number of Analog In Channels 8 8
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 28 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Bit Code BINARY OFFSET BINARY
Output Format PARALLEL, 8 BITS PARALLEL, 8 BITS
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Sample Rate 0.01 MHz
Sample and Hold / Track and Hold SAMPLE SAMPLE
Seated Height-Max 5.334 mm 5.08 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 15.24 mm 7.62 mm
Base Number Matches 3 2
Part Package Code DIP
Pin Count 20
Supply Current-Max 3 mA

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Compare ML2258BMJ with alternatives