ADC-HZ12BMC-C
vs
ADC-HX12BMM-C
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DATEL INC
|
DATEL INC
|
| Package Description |
DIP, DIP32,.9
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
8 µs
|
20 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T32
|
R-CDIP-T32
|
| Length |
43.69 mm
|
43.69 mm
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0122%
|
| Negative Supply Voltage-Nom |
-15 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Bit Code |
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP32,.9
|
DIP32,.9
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Sample Rate |
2.2 MHz
|
|
| Seated Height-Max |
5.969 mm
|
5.969 mm
|
| Supply Current-Max |
85 mA
|
|
| Supply Voltage-Nom |
15 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
28.19 mm
|
28.19 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
|
|
|
Compare ADC-HZ12BMC-C with alternatives
Compare ADC-HX12BMM-C with alternatives