ADC-HX12BMM
vs
ADC-HX/883
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
C&D TECHNOLOGIES INC
|
C&D TECHNOLOGIES INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP32,.9
|
DIP,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
10 V
|
10 V
|
Analog Input Voltage-Min |
-10 V
|
-10 V
|
Conversion Time-Max |
20 µs
|
20 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
R-CDIP-T32
|
R-CDIP-T32
|
JESD-609 Code |
e4
|
e4
|
Linearity Error-Max (EL) |
0.0122%
|
0.0122%
|
Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Bit Code |
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP32,.9
|
DIP32,.9
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.969 mm
|
5.969 mm
|
Supply Voltage-Nom |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Technology |
HYBRID
|
HYBRID
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
GOLD
|
GOLD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
22.86 mm
|
22.86 mm
|
Base Number Matches |
3
|
3
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare ADC-HX12BMM with alternatives
Compare ADC-HX/883 with alternatives