ADC-HX12BMM
vs
HS574AK
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MURATA POWER SOLUTIONS INC
|
SATCON ELECTRONICS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP32,.9
|
DIP,
|
| Pin Count |
32
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
20 µs
|
25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T32
|
R-CDIP-T28
|
| JESD-609 Code |
e4
|
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0122%
|
| Negative Supply Voltage-Nom |
-15 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
28
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Bit Code |
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP32,.9
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.969 mm
|
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
GOLD OVER NICKEL
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
22.86 mm
|
|
| Base Number Matches |
4
|
4
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
|
|
|
Compare ADC-HX12BMM with alternatives
Compare HS574AK with alternatives